Bok Gyu Min

4 Patents

• US125819612026

  Substrate Having a Die Position Mark and a Semiconductor Die Stack Structure Including Semiconductor Dies Stacked on the Substrate

  SK Hynix Inc.

  0 cites
• US120339522024

  Semiconductor Packages Including at Least One Die Position Checker

  SK Hynix Inc.

  0 cites
• US117697002023

  Semiconductor Substrate, Semiconductor Package Including Semiconductor Substrate, and Test Method of Semiconductor Substrate

  SK Hynix Inc.

  0 cites
• US117641602023

  Semiconductor Packages Including at Least One Die Position Checker

  SK Hynix Inc.

  0 cites