Patents/Inventors

Bohan Yan

San Diego, CAUS1 patent

2 Patents

US126108692026
Integrated Circuit (IC) Package Employing a Metal Block with Metal Interconnects Thermally Coupling a Die to an Interposer Substrate for Dissipating Thermal Energy of the Die, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US117495792023
Thermal Structures Adapted to Electronic Device Heights in Integrated Circuit (IC) Packages
QUALCOMM INCORPORATED
0 cites