6 Patents
- US126160522026Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites - US124128682025Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
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- US120339302024Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites - US117537312023Two-dimensional Metal-organic Framework Alloy Photocatalysts
Arizona Board Of Regents On Behalf Of Arizona State University
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