Patents/Inventors

Bob Lee

New TaipeiTW4 patents

5 Patents

US124890372025
Semiconductor Package Substrate with a Smooth Groove Straddling Topside and Sidewall
TEXAS INSTRUMENTS INCORPORATED
0 cites
US124762042025
Semiconductor Package Substrate with Groove on Die Pad
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120625962024
Semiconductor Die with Stepped Side Surface
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118231862023
Secure Wireless Card Reader
BLOCK, Inc.
0 cites
US117912892023
Semiconductor Package Substrate with a Smooth Groove About a Perimeter of a Semiconductor Die
TEXAS INSTRUMENTS INCORPORATED
0 cites