Bo Mook Chung

4 Patents

• US125344262026

  Leveler and Electroplating Composition for Filling via Hole

  YMT CO., Ltd.

  0 cites
• US124954942025

  Metal Foil, Carrier with Metal Foil Comprising the Same and Printed Circuit Board Including the Same

  YMT CO., Ltd

  0 cites
• US124082792025

  Release Layer for Metal Foil with Carrier and Metal Foil Comprising the Same

  YMT CO., Ltd.

  0 cites
• US121398112024

  Carrier Foil-attached Metal Foil, Method of Manufacturing the Same, and Laminate Including the Same

  YMT CO., Ltd.

  0 cites