Patents/Inventors

Bo-jiun Lin

Hsinchu CountyTW8 patents

9 Patents

US123277922025
Semiconductor Structure and Manufacturing Methods Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123004862025
System and Method of Forming a Porous Low-k Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122495742025
Interconnect Structure of Semiconductor Device and Method of Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121425212024
Interconnect Structure and Semiconductor Device Having the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120947712024
Interconnect Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119843162024
Porogen Bonded Gap Filling Material in Semiconductor Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119570702024
Semiconductor Device, Memory Cell and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116581202023
Porogen Bonded Gap Filling Material in Semiconductor Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116370102023
System and Method of Forming a Porous Low-k Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites