Patents/Inventors

Bo Hua Chen

KaohsiungTW1 patent

2 Patents

US121129652024
Wafer Supporting Mechanism and Method for Wafer Dicing
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US115878092023
Wafer Supporting Mechanism and Method for Wafer Dicing
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites