Patents/Inventors

Bo-hsun Pan

New TaipeiTW7 patents

7 Patents

US125327522026
Packages with Multiple Exposed Pads
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119424482024
Integrated Circuit Die Pad Cavity
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118625382024
Semiconductor Die Mounted in a Recess of Die Pad
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118482972023
Semiconductor Device Packages with High Angle Wire Bonding and Non-gold Bond Wires
Texas Instruments Incorporated
0 cites
US118173742023
Electronic Device with Exposed Tie Bar
Texas Instruments Incorporated
0 cites
US117422652023
Exposed Heat-generating Devices
TEXAS INSTRUMENTS INCORPORATED
0 cites
US117355062023
Packages with Multiple Exposed Pads
TEXAS INSTRUMENTS INCORPORATED
0 cites