Bo-chang Su

2 Patents

• US124532032025

  Deep Trench Isolation Structures Resistant to Cracking

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120466152024

  Semiconductor Device Including Deep Trench Isolation Structure Comprising Dielectric Structure and Copper Structure and Method of Making the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

  0 cites