4 Patents
- US124762302025Embedded Packaging Structure and Method for Manufacturing the Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US123025082025Temporary Carrier and Method for Manufacturing Coreless Substrate Thereby
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US120741152024Heat Dissipation-electromagnetic Shielding Embedded Packaging Structure, Manufacturing Method Thereof, and Substrate
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US119424652024Embedded Structure, Manufacturing Method Thereof and Substrate
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites