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Bilal Khalaf
Folsom, CA
US
6 patents
6 Patents
US11894334
2024
Dual Head Capillary Design for Vertical Wire Bond
Intel Corporation
0 cites
US11848311
2023
Microelectronic Packages Having a Die Stack and a Device Within the Footprint of the Die Stack
Intel Corporation
0 cites
US11817438
2023
System in Package with Interconnected Modules
Intel Corporationd
0 cites
US11811182
2023
Solderless BGA Interconnect
Intel Corporation
0 cites
US11710674
2023
Embedded Component and Methods of Making the Same
Intel Corporation
0 cites
US11700696
2023
Buried Electrical Debug Access Port
Intel Corporation
0 cites