Biancun Xie

4 Patents

• US123411292025

  Substrateless Double-sided Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites
• US121609522024

  Providing a Lower Inductance Path in a Routing Substrate for a Capacitor, and Related Electronic Devices and Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US117496612023

  Package Comprising a Substrate and a Multi-capacitor Integrated Passive Device

  QUALCOMM INCORPORATED

  0 cites
• US116263592023

  Three-dimensional Integrated Circuit (3D IC) Power Distribution Network (PDN) Capacitor Integration

  QUALCOMM Incorporated

  0 cites