Patents/Inventors

Bert Reents

BerlinDE2 patents

3 Patents

US124395282025
Method of Preparing a High Density Interconnect Printed Circuit Board Including Microvias Filled with Copper
Atotech Deutschland GmbH & Co. KG
0 cites
US122453832025
Method of Preparing a High Density Interconnect Printed Circuit Board Including Microvias Filled with Copper
Atotech Deutschland GmbH & Co. KG
0 cites
US120637512024
Manufacturing Sequences for High Density Interconnect Printed Circuit Boards and a High Density Interconnect Printed Circuit Board
Atotech Deutschland GmbH & Co. KG
0 cites