8 Patents
- US124127402025Semiconductor Device with a Porous Portion, Wafer Composite and Method of Manufacturing a Semiconductor Device
Infineon Technologies AG
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- US122117032025Methods for Forming a Semiconductor Device Having a Second Semiconductor Layer on a First Semiconductor Layer
Infineon Technologies AG
0 cites - US120602662024Method with Mechanical Dicing Process for Producing MEMS Components
Infineon Technologies AG
0 cites - US118813972024Semiconductor Device with a Porous Portion, Wafer Composite and Method of Manufacturing a Semiconductor Device
Infineon Technologies AG
0 cites - 0 cites
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- US117127492023Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
Infineon Technologies AG
0 cites