Patents/Inventors

Bernd Waidhas

PettendorfDE24 patents

21 Patents

US126223192026
Stacked Die Packaging Architecture with Conductive Vias on Interposer
Intel Corporation
0 cites
US124396162025
Integrated Circuit Package Redistribution Layers with Metal-insulator-metal (MIM) Capacitors
Intel Corporation
0 cites
US124314242025
Buried Power Rails Integrated with Decoupling Capacitance
Intel Corporation
0 cites
US124069252025
Bare-die Smart Bridge Connected with Copper Pillars for System-in-package Apparatus
Intel Corporation
0 cites
US123947262025
Method to Implement Wafer-level Chip-scale Packages with Grounded Conformal Shield
Intel Corporation
0 cites
US123746252025
Microelectronic Assemblies Having Topside Power Delivery Structures
Intel Corporation
0 cites
US123622512025
Fan Out Package with Integrated Peripheral Devices and Methods
Intel Corporation
0 cites
US123410962025
Bare-die Smart Bridge Connected with Copper Pillars for System-in-package Apparatus
Intel Corporation
0 cites
US122438562025
Fan Out Packaging Pop Mechanical Attach Method
Intel Corporation
0 cites
US122438282025
Microelectronic Assemblies Having Topside Power Delivery Structures
Intel Corporation
0 cites
US122117962025
Microelectronic Assemblies Having Topside Power Delivery Structures
Intel Corporation
0 cites
US121915712025
Antenna with Graded Dielectirc and Method of Making the Same
Intel Corporation
0 cites
US121258152024
Assembly of 2XD Module Using High Density Interconnect Bridges
Intel Corporation
0 cites
US120806552024
Method to Implement Wafer-level Chip-scale Packages with Grounded Conformal Shield
Intel Corporation
0 cites
US120573642024
Package Formation Methods Including Coupling a Molded Routing Layer to an Integrated Routing Layer
Intel Corporation
0 cites
US120574112024
Stress Relief Die Implementation
Intel Corporation
0 cites
US119553952024
Fan Out Package with Integrated Peripheral Devices and Methods
Intel Corporation
0 cites
US118774032024
Printed Wiring-board Islands for Connecting Chip Packages and Methods of Assembling Same
Intel Corporation
0 cites
US117641872023
Semiconductor Packages, and Methods for Forming Semiconductor Packages
Intel Corporation
0 cites
US117355702023
Fan Out Packaging Pop Mechanical Attach Method
Intel Corporation
0 cites
US115812872023
Chip Scale Thin 3D Die Stacked Package
Intel Corporation
0 cites