Patents/Inventors

Bernd Schmoelzer

RadentheinAT13 patents

11 Patents

US125123802025
Semiconductor Packages Including a Package Body with Grooves Formed Therein
Infineon Technologies AG
0 cites
US125060512025
Semiconductor Package Comprising a Cavity with Exposed Contacts and a Semiconductor Module
Infineon Technologies Austria AG
0 cites
US124631162025
Method for Fabricating a Semiconductor Device Including an Embedded Semiconductor Die
Infineon Technologies Austria AG
0 cites
US124380682025
Stacked Module Arrangement
Infineon Technologies Austria AG
0 cites
US121257722024
Method of Forming a Semiconductor Package with Connection Lug
Infineon Technologies Austria AG
0 cites
US120947932024
Package with Electrically Insulated Carrier and at Least One Step on Encapsulant
Infineon Technologies AG
0 cites
US120806692024
Semiconductor Device Module Having Vertical Metallic Contacts and a Method for Fabricating the Same
Infineon Technologies Austria AG
0 cites
US120027392024
Semiconductor Device Including an Embedded Semiconductor Die
Infineon Technologies Austria AG
0 cites
US119423832024
Linear Spacer for Spacing a Carrier of a Package
Infineon Technologies AG
0 cites
US118760282024
Package with Electrically Insulated Carrier and at Least One Step on Encapsulant
Infineon Technologies AG
0 cites
US117282502023
Semiconductor Package with Connection Lug
Infineon Technologies Austria AG
0 cites