5 Patents
- 0 cites
- US124446712025Semiconductor Component with Damped Bonding Surfaces in a Package with Encapsulated Pins
Siemens Aktiengesellschaft
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- US121366032024Semiconductor Arrangement Comprising a Semiconductor Element, a Substrate and Bond Connecting Means
Siemens Aktiengesellschaft
0 cites - US118884072024Power Module Having at Least Two Power Semiconductor Arrangements That Are Contacted on a Substrate
Siemens Aktiengesellschaft
0 cites