Patents/Inventors

Bernd Karl Appelt

Holly Springs, NCUS16 patents

20 Patents

US122835372025
Electronic Package and Method of Forming the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US121989992025
Electronic Package Including a Protection Layer
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US120093172024
Semiconductor Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US120027292024
Electronic Package and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US120027432024
Electronic Carrier and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119618312024
Electronic Package, Semiconductor Package Structure, and Method for Manufacturing the Semiconductor Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118814482024
Semiconductor Package Structure Having Substrate with Embedded Electronic Component and Conductive Pillars
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118307982023
Semiconductor Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118307992023
Semiconductor Device Package, Antenna Device, and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117912452023
Electronic Package and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117354332023
Substrate Structure, Package Structure and Method for Manufacturing Electronic Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117054012023
Semiconductor Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116826562023
Semiconductor Device Package and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116643012023
Semiconductor Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116643392023
Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116316332023
Substrate Structure, Semiconductor Package Structure and Method for Manufacturing Semiconductor Package Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116160072023
Electronic Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116108342023
Leadframe Including Conductive Pillar Over Land of Conductive Layer
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US115748562023
Semiconductor Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US115454062023
Substrate Structure, Semiconductor Package Structure and Method for Manufacturing a Substrate Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites