37 Patents
- US126222922026Two-sided Interconnected Embedded Chip Packaging Structure and Manufacturing Method Therefor
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US126220912026Light-emitting Photosensitive Sensor Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US126222952026Signal-heat Separated TMV Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US126044142026Temporary Carrier Plate and Manufacturing Method Thereof, and Manufacturing Method for Packaging Substrate
Nantong ACCESS Semiconductor CO., Ltd.
0 cites - US125989912026Liquid Circulating Cooling Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US125990192026Embedded Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US125885432026Embedded Flip Chip Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US125507742026Carrier Plate for Preparing Package Substrate, Package Substrate Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US125327692026Package Substrate Based on Molding Process and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US124762302025Embedded Packaging Structure and Method for Manufacturing the Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - 0 cites
- US124514472025Substrate Embedded with Integrated Inductor and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US124189882025Inductor-integrating Embedded Support Frame and Substrate, and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US124128432025Support Frame Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd.
0 cites - US124009672025Embedded Packaging Structure and Manufacturing Method Thereof
NANTONG ACCESS SEMICONDUCTOR CO., Ltd.
0 cites - US124024142025Capacitor and Inductor Embedded Structure and Manufacturing Method Therefor, and Substrate
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US123005762025Cyclic Cooling Embedded Packaging Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US123025082025Temporary Carrier and Method for Manufacturing Coreless Substrate Thereby
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US123005112025Fabrication Method for Package Structure
Zhuhai YUEXIN Semiconductor Limited Liability Company
0 cites - US122782272025Hybrid Embedded Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US122793772025Conductive Substrate and Carrier Plate Wiring Structure with Filtering Function, and Manufacturing Method of Same
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US122305812025Multi-device Graded Embedding Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US121486762024Embedded Chip Package and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US120741152024Heat Dissipation-electromagnetic Shielding Embedded Packaging Structure, Manufacturing Method Thereof, and Substrate
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US120405262024Method for Manufacturing Embedded Package Structure Having Air Resonant Cavity
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US120402722024Connector for Implementing Multi-faceted Interconnection
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US120027342024Circuit Prearranged Heat Dissipation Embedded Packaging Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US119844142024Packaging Structure with Antenna and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US119617432024Substrate Manufacturing Method for Realizing Three-dimensional Packaging
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd.
0 cites - US119424652024Embedded Structure, Manufacturing Method Thereof and Substrate
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US119031332024Structure for Embedding and Packaging Multiple Devices by Layer and Method for Manufacturing Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US118549202023Embedded Chip Package and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US118221212023Cavity Substrate Having Directional Optoelectronic Transmission Channel and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - 0 cites
- US116826212023Connector for Implementing Multi-faceted Interconnection
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US115793622023Cavity Substrate Having Directional Optoelectronic Transmission Channel and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US115691772023Support Frame Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites