Benjamin T. Duong

5 Patents

• US126160422026

  Microelectronic Assemblies with Anchor Layer Around a Bridge Die

  Intel Corporation

  0 cites
• US125469572026

  Photonic Integrated Circuit Packaging Architectures

  Intel Corporation

  0 cites
• US124761752025

  Glass Substrates Having Transverse Capacitors for Use with Semiconductor Packages and Related Methods

  Intel Corporation

  0 cites
• US122495842025

  Microelectronic Assemblies Having Integrated Magnetic Core Inductors

  Intel Corporation

  0 cites
• US119488982024

  Etch Barrier for Microelectronic Packaging Conductive Structures

  Intel Corporation

  0 cites