Patents/Inventors

Benjamin L. Mcclain

Boise, IDUS4 patents

5 Patents

US120877202024
Semiconductor Device Assembly with Surface-mount Die Support Structures
Micron Technology, Inc.
0 cites
US120806782024
Methods and Systems for Manufacturing Semiconductor Devices
Micron Technology, Inc.
0 cites
US117054252023
Thermocompression Bond Tips and Related Apparatus and Methods
MICRON TECHNOLOGY, Inc.
0 cites
US116706122023
Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
Micron Technology, Inc.
0 cites
US115944322023
Cold Fluid Semiconductor Device Release During Pick and Place Operations, and Associated Systems and Methods
Micron Technology, Inc.
0 cites