21 Patents
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- US125387782026Fabricating Dual Damascene Structures Using Multilayer Photosensitive Dielectrics
Applied Materials, Inc.
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- US122180032025Selective ILD Deposition for Fully Aligned via with Airgap
Adeia Semiconductor Solutions LLC
0 cites - 0 cites
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- US120558212024Structure and Method of Bi-layer Pixel Isolation in Advanced LCOS Back-plane
Applied Materials, Inc.
0 cites - US119086782024Method of CMP Integration for Improved Optical Uniformity in Advanced LCOS Back-plane
Applied Materials, Inc.
0 cites - 0 cites
- US118815392024Structure and Method of Advanced Lcos Back-plane Having Highly Reflective Pixel via Metallization
Applied Materials, Inc.
0 cites - US118697832024Optimizating Semiconductor Binning by Feed-forward Process Adjustment
International Business Machines Corporation
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- US117567862023Forming High Carbon Content Flowable Dielectric Film with Low Processing Damage
International Business Machines Corporation
0 cites - US117355242023Electrical Device Having Conductive Lines with Air Gaps Therebetween and Interconnects Without Exclusion Zones
INTERNATIONAL BUSINESS MACHINES CORPORATION
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- US116363532023Cognitive System for Localized LIDAR Pollution Detection Using Autonomous Vehicles
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US115860672023Structure and Method of Advanced Lcos Back-plane Having Robust Pixel via Metallization
Applied Materials, Inc.
0 cites - 0 cites
- US115734522023Method for Lcos DBR Multilayer Stack Protection via Sacrificial Hardmask for RIE and CMP Processes
Applied Materials, Inc.
0 cites - US115748642023Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Tessera LLC
0 cites