35 Patents
- 0 cites
- US125587562026Profile Control During Polishing of a Stack of Adjacent Conductive Layers
Applied Materials, Inc.
0 cites - US125481462026Detecting an Excursion of a CMP Component Using Time-based Sequence of Images
Applied Materials, Inc.
0 cites - 0 cites
- US125043642025In-situ Monitoring to Label Training Spectra for Machine Learning System for Spectrographic Monitoring
Applied Materials, Inc.
0 cites - 0 cites
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- US124409422025Pressure Signals with Different Frequencies During Friction Monitoring to Provide Spatial Resolution
Applied Materials, Inc.
0 cites - US124203732025Control of Processing Parameters During Substrate Polishing Using Cost Function
Applied Materials, Inc.
0 cites - 0 cites
- US123438402025Control of Processing Parameters for Substrate Polishing with Substrate Precession
Applied Materials, Inc.
0 cites - US123114942025Pressure Signals During Motor Torque Monitoring to Provide Spatial Resolution
Applied Materials, Inc.
0 cites - 0 cites
- US121481492024Training a Machine Learning System to Detect an Excursion of a CMP Component Using Time-based Sequence of Images
Applied Materials, Inc.
0 cites - US121365742024Technique for Training Neural Network for Use in In-situ Monitoring During Polishing and Polishing System
Applied Materials, Inc.
0 cites - US120905992024Determination of Substrate Layer Thickness with Polishing Pad Wear Compensation
Applied Materials, Inc.
0 cites - US120799842024Detecting an Excursion of a CMP Component Using Time-based Sequence of Images
Applied Materials, Inc.
0 cites - US120573542024Trained Neural Network in In-situ Monitoring During Polishing and Polishing System
Applied Materials, Inc.
0 cites - US120201592024Training Spectrum Generation for Machine Learning System for Spectrographic Monitoring
Applied Materials, Inc.
0 cites - US119698542024Control of Processing Parameters During Substrate Polishing Using Expected Future Parameter Changes
Applied Materials, Inc.
0 cites - 0 cites
- US119318532024Control of Processing Parameters for Substrate Polishing with Angularly Distributed Zones Using Cost Function
Applied Materials, Inc.
0 cites - US119191212024Control of Processing Parameters During Substrate Polishing Using Constrained Cost Function
Applied Materials, Inc.
0 cites - US118656642024Profile Control with Multiple Instances of Contol Algorithm During Polishing
Applied Materials, Inc.
0 cites - 0 cites
- US118506992023Switching Control Algorithms on Detection of Exposure of Underlying Layer During Polishing
Applied Materials, Inc.
0 cites - US117912242023Technique for Training Neural Network for Use in In-situ Monitoring During Polishing and Polishing System
Applied Materials, Inc.
0 cites - US117800472023Determination of Substrate Layer Thickness with Polishing Pad Wear Compensation
Applied Materials, Inc.
0 cites - US117312382023Monitoring of Polishing Pad Texture in Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites - US117336862023Machine Learning Systems for Monitoring of Semiconductor Processing
Applied Materials, Inc.
0 cites - US117102282023Detecting an Excursion of a CMP Component Using Time-based Sequence of Images and Machine Learning
Applied Materials, Inc.
0 cites - US116971872023Temperature-based Assymetry Correction During CMP and Nozzle for Media Dispensing
Applied Materials, Inc.
0 cites - US116580782023Using a Trained Neural Network for Use in In-situ Monitoring During Polishing and Polishing System
Applied Materials, Inc.
0 cites - US116512072023Training Spectrum Generation for Machine Learning System for Spectrographic Monitoring
Applied Materials, Inc.
0 cites - 0 cites