Patents/Inventors

Benedict W. Pang

Burlingame, CAUS1 patent

2 Patents

US122576642025
Controlling Chemical Mechanical Polishing Pad Stiffness by Adjusting Wetting in the Backing Layer
Applied Materials, Inc.
0 cites
US120906002024
Face-up Wafer Electrochemical Planarization Apparatus
Applied Materials, Inc.
0 cites