Patents/Inventors

Belkacem Mouhouche

StainesGB19 patents

20 Patents

US123637962025
Method and Apparatus for Transmission Mode Switching in Wireless Communication System
Samsung Electronics Co., Ltd.
0 cites
US121668492024
Data Structure for Physical Layer Encapsulation
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121325992024
Non-uniform Constellations
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120579882024
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119494332024
Transmitting Apparatus and Interleaving Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119298642024
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118381662023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118313302023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118114972023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117846622023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117776432023
Transmitting Apparatus and Modulation Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117576932023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117430952023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117160982023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116956132023
Non-uniform Constellations
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116778672023
Data Structure for Physical Layer Encapsulation
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116412142023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116376552023
Transmitting Apparatus and Interleaving Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116377352023
Transmitting Apparatus and Mapping Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115634482023
Receiving Apparatus and De-interleaving Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites