Bed Raj Kandel

3 Patents

• US125817132026

  Via Alternate Net Spacing

  QUALCOMM INCORPORATED

  0 cites
• US123549522025

  Integrated Circuits (ics) Employing Multi-pattern Metallization to Optimize Metal Interconnect Spacing for Improved Performance and Related Fabrication Methods

  QUALCOMM Incorporated

  0 cites
• US116582502023

  Metal-oxide Semiconductor (MOS) Capacitor (MOSCAP) Circuits and MOS Device Array Bulk Tie Cells for Increasing MOS Device Array Density

  QUALCOMM Incorporated

  0 cites