Bassam Abdel-dayem

4 Patents

• US121320282024

  Semiconductor Package with Capacitance Die

  Amazon Technologies, Inc.

  0 cites
• US120669642024

  Highly Available Modular Hardware Acceleration Device

  Amazon Technologies, Inc.

  0 cites
• US120339602024

  Semiconductor Package with Stiffener Ring Having Elevated Opening

  Amazon Technologies, Inc.

  0 cites
• US119233472024

  Semiconductor Package with Multiple Interposers on a Single Substrate

  Amazon Technologies, Inc.

  0 cites