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Baosuo Zhou
Boise, ID
US
2 patents
3 Patents
US12463044
2025
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same
0 cites
US12120878
2024
Block-to-block Isolation and Deep Contact Using Pillars in a Memory Array
Intel Corporation
0 cites
US11935756
2024
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same
0 cites