6 Patents
- US125433272026On-chip All-solid-state Supercapacitor and Preparation Method Thereof
SHANGHAI INTEGRATED CIRCUIT MANUFACTURING INNOVATION CENTER CO., Ltd
0 cites - US121989802025Metal Interconnection Structure and Manufacturing Method Thereof
SHANGHAI INTEGRATED CIRCUIT MANUFACTURING INNOVATION CENTER CO., Ltd.
0 cites - US121591792024Three-dimensional Integrated System of RFID Chip and Super Capacitor and Preparation Method Thereof
Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
0 cites - US118879122024Through Silicon via Structure for Three-dimensional Integrated Circuit Packaging and Manufacturing Method Thereof
Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
0 cites - US118814422024SOI Active Transfer Board for Three-dimensional Packaging and Preparation Method Thereof
Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
0 cites - US118549392023Three-dimensional Integrated System of Dram Chip and Preparation Method Thereof
Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
0 cites