Patents/Inventors

Bangweon Lee

Yongin-siKR4 patents

5 Patents

US124944122025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124697642025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122438032025
Thermal Interface Material, Method of Manufacturing the Same, and Semiconductor Packages Including the Same
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites
US119358122024
Thermal Interface Material and Semiconductor Packages Including the Same
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites
US118550132023
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites