Bamidele Daniel Falola

6 Patents

• US125884992026

  Integrated Circuit Heat Spreader Including Sealant Interface Material

  Intel Corporation

  0 cites
• US121836882024

  Integrated Circuit Die Package Stiffeners of Metal Alloys Having Exceptionally High CTE

  Intel Corporation

  0 cites
• US121660042024

  Solder Thermal Interface Material (STIM) with Dopant

  Intel Corporation

  0 cites
• US118173692023

  Lids for Integrated Circuit Packages with Solder Thermal Interface Materials

  Intel Corporation

  0 cites
• US117988612023

  Integrated Heat Spreader (IHS) with Heating Element

  Intel Corporation

  0 cites
• US116705692023

  Channeled Lids for Integrated Circuit Packages

  Intel Corporation

  0 cites