Patents/Inventors

Bai Nie

Chandler, AZUS19 patents

16 Patents

US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US125607712026
Die First Fan-out Architecture for Electric and Optical Integration
Intel Corporation
0 cites
US125469572026
Photonic Integrated Circuit Packaging Architectures
Intel Corporation
0 cites
US125435782026
Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
0 cites
US125045812025
Photonic Interconnect and Components in Glass
Intel Corporation
0 cites
US124226152025
Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites
US123947192025
Methods and Apparatus to Increase Glass Core Thickness
Intel Corporation
0 cites
US123548832025
Omni Directional Interconnect with Magnetic Fillers in Mold Matrix
Intel Corporation
0 cites
US123549632025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US123459322025
Die Last and Waveguide Last Architecture for Silicon Photonic Packaging
Intel Corporation
0 cites
US123344432025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US119293302024
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US119233072024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US118375342023
Substrate with Variable Height Conductive and Dielectric Elements
Intel Corporation
0 cites
US116948982023
Hybrid Fine Line Spacing Architecture for Bump Pitch Scaling
Intel Corporation
0 cites