Patents/Inventors

Bae-yinn Hwang

Taipei CityTW7 patents

4 Patents

US125990452026
Sensor Chips Having Columnar Microstructures Embedded and Surrounded by Adhesive Layer in a Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites
US125638502026
Optical Package Structure
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites
US125504632026
Sensor Package Structure and Sensing Module Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites
US122565732025
Sensor Package Structure
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites