Patents/Inventors

Ayumu Tateoka

NantouTW2 patents

3 Patents

US124576862025
Roughened Copper Foil, Copper-cladded Laminate Board, and Printed Wiring Board
MITSUI MINING & SMELTING CO., Ltd.
0 cites
US123312122025
Resin Composition, Copper Foil with Resin, and Printed Wiring Board
MITSUI MINING & SMELTING CO., Ltd.
0 cites
US121042652024
Roughened Copper Foil, Copper-clad Laminate and Printed Wiring Board
MITSUI MINING & SMELTING CO., Ltd.
0 cites