Patents/Inventors

Ayane Nakaue

OsakaJP1 patent

2 Patents

US121988342025
Resin Composition and Moulded Article
DAIKIN INDUSTRIES, Ltd.
0 cites
US119394502024
Resin Composition for Circuit Board, Molded Body for Circuit Board, Layered Body for Circuit Board, and Circuit Board
DAIKIN INDUSTRIES, Ltd.
0 cites