Patents/Inventors

Atsushi Tsuura

AnnakaJP1 patent

2 Patents

US124214352025
Adhesive Composition for Flexible Printed-wiring Board (FPC), and Heat-curable Resin Film, Prepreg and FPC Substrate Containing Same
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US116084382023
Low-dielectric Heat Dissipation Film Composition and Low-dielectric Heat Dissipation Film
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites