3 Patents
- US122781552025Integrated Circuit Package with Heat Sink and Manufacturing Method Thereof
Stmicroelectronics (Grenoble 2) SAS
0 cites - US121702622024Method for Forming an Electrical Connection Between an Electronic Chip and a Carrier Substrate and Electronic Device
Stmicroelectronics (Grenoble 2) SAS
0 cites - US115575662023Method for Forming an Electrical Connection Between an Electronic Chip and a Carrier Substrate and Electronic Device
Stmicroelectronics (Grenoble 2) SAS
0 cites