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Arvinder S. Chadha
San Jose, CA
US
1 patent
2 Patents
US12469733
2025
Wafer to Baseplate Arc Prevention Using Textured Dielectric
APPLIED MATERIALS, Inc.
0 cites
US12224192
2025
Bowed Substrate Clamping Method, Apparatus, and System
APPLIED MATERIALS, Inc.
0 cites