9 Patents
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- US121660052024Semiconductor Device Having a Soldered Joint with One or More Intermetallic Phases
Infineon Technologies Austria AG
0 cites - US121487182024Housing, Semiconductor Module and Methods for Producing the Same
Infineon Technologies AG
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- US119358112024Baseplate for a Semiconductor Module and Method for Producing a Baseplate
Infineon Technologies AG
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- US116520282023Power Semiconductor Device and Method for Fabricating a Power Semiconductor Device
Infineon Technologies AG
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