Arnab Sarkar

4 Patents

• US124698012025

  Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly

  Intel Corporation

  0 cites
• US121425532024

  Guard Ring Design Enabling In-line Testing of Silicon Bridges for Semiconductor Packages

  Intel Corporation

  0 cites
• US117282582023

  Electroless Metal-defined Thin Pad First Level Interconnects for Lithographically Defined Vias

  Intel Corporation

  0 cites
• US116768892023

  Guard Ring Design Enabling In-line Testing of Silicon Bridges for Semiconductor Packages

  Intel Corporation

  0 cites