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Aparna R. Prasad
San Jose, CA
US
4 patents
4 Patents
US12504590
2025
Optical Wafer-level Package
Cisco Technology, Inc.
0 cites
US12461304
2025
Optical Packaging Features for Mechanical Stability and Optical Fiber Coupling
Cisco Technology, Inc.
0 cites
US11762155
2023
Photonics Packaging Platform
Cisco Technology, Inc.
0 cites
US11756861
2023
Thermal Packaging with Fan Out Wafer Level Processing
Cisco Technology, Inc.
0 cites