14 Patents
- US126047862026Method of Atomic Diffusion Hybrid Bonding and Apparatus Made from Same
Intel Corporation
0 cites - US124874172025Photonic Glass Layer Substrate with Embedded Optical Structures for Communicating with an Electro Optical Integrated Circuit
Applied Materials, Inc.
0 cites - US124631802025Monolithic Chip Stacking Using a Die with Double-sided Interconnect Layers
Intel Corporation
0 cites - 0 cites
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- US123623252025Monolithic Chip Stacking Using a Die with Double-sided Interconnect Layers
Intel Corporation
0 cites - US123459342025Methods for Fabrication of Optical Structures on Photonic Glass Layer Substrates
Applied Materials, Inc.
0 cites - 0 cites
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- US119089812024Laser Printing of Color Converter Devices on Micro Led Display Devices and Methods
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US117841652023Monolithic Chip Stacking Using a Die with Double-sided Interconnect Layers
Intel Corporation
0 cites - US116597222023Thin-film-transistor Based Complementary Metal-oxide-semiconductor (CMOS) Circuit
Intel Corporation
0 cites - 0 cites
- US116109362023Micro Light-emitting Diode Displays Having Color Conversion Devices and Assembly Approaches
Intel Corporation
0 cites