8 Patents
- US124917162025Corrosion Tolerant Micro-electromechanical Fluid Ejection Device
Hewlett-packard Development Company, L.P.
0 cites - US123910442025Fluid Ejection Device with Break(s) in Cover Layer
Hewlett-packard Development Company, L.P.
0 cites - US118270212023Applying Mold Chase Structure to End Portion of Fluid Ejection Die
Hewlett-packard Development Company, L.P.
0 cites - US117871802023Corrosion Tolerant Micro-electromechanical Fluid Ejection Device
Hewlett-packard Development Company, L.P.
0 cites - US117455072023Fluid Ejection Device with Break(s) in Cover Layer
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
- 0 cites
- US116390552023Fluid Ejection Devices Including Contact Pads
Hewlett-packard Development Company, L.P.
0 cites