Patents/Inventors

Anju Okada

TokyoJP1 patent

2 Patents

US120681152024
Ceramic Electronic Component, Circuit Substrate Arrangement, and Method of Manufacturing Ceramic Electronic Component
TAIYO YUDEN CO., Ltd.
0 cites
US119158792024
Electronic Component, Circuit Board Arrangement and Method of Manufacturing Electronic Component
TAIYO YUDEN CO., Ltd.
0 cites