15 Patents
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- US124631582025Microelectronic Device Package with Integral Antenna Module and Semiconductor Device
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- US121257992024Embedded Die Packaging with Integrated Ceramic Substrate
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0 cites - US120741342024Package for Stress Sensitive Component and Semiconductor Device
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0 cites - US120572642024Forming Integrated Inductors and Transformers with Embedded Magnetic Cores
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- US119423842024Semiconductor Package Having an Interdigitated Mold Arrangement
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