Aniket Patil

34 Patents

• US125937092026

  Substrate(s) for an Integrated Circuit (IC) Package Employing a Core Layer and an Adjacent Insulation Layer(s) with an Embedded Metal Structure(s) Positioned from the Core Layer

  QUALCOMM INCORPORATED

  0 cites
• US125641072026

  Package Comprising Optical Integrated Device

  QUALCOMM INCORPORATED

  0 cites
• US125435992026

  Package Comprising a First Substrate, a Second Substrate and an Electrical Device Coupled to a Bottom Surface of the Second Substrate

  QUALCOMM INCORPORATED

  0 cites
• US125116082025

  System and Method for Address Verification

  Doordash, Inc.

  0 cites
• US125124122025

  Substrate with Multiple Core Layers to Provide Varied Thickness Cavities Supporting Varied Thickness Embedded Electrical Devices, and Related Integrated Circuit (IC) Packages and Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US124110152025

  System and Method for Predicted Pins

  DOORDASH, Inc.

  0 cites
• US123811742025

  Integrated Circuit (IC) Packages Employing Wire Bond Channel Over Package Substrate, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US122438552025

  Package Comprising Channel Interconnects Located Between Solder Interconnects

  QUALCOMM INCORPORATED

  0 cites
• US122305522025

  Recess Structure for Padless Stack Via

  QUALCOMM INCORPORATED

  0 cites
• US121006452024

  Integrated Circuit (IC) Package Employing Added Metal for Embedded Metal Traces in Ets-based Substrate for Reduced Signal Path Impedance, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US120210632024

  Circular Bond Finger Pad

  QUALCOMM INCORPORATED

  0 cites
• US119554092024

  Substrate Comprising Interconnects in a Core Layer Configured for Skew Matching

  QUALCOMM INCORPORATED

  0 cites
• US119488772024

  Hybrid Package Apparatus and Method of Fabricating

  QUALCOMM INCORPORATED

  0 cites
• US118896502024

  Integrated Direct Mount Branch Protection for Variable Frequency Drive

  Eaton Intelligent Power Limited

  0 cites
• US118323912023

  Terminal Connection Routing and Method the Same

  QUALCOMM INCORPORATED

  0 cites
• US118173652023

  Thermal Mitigation Die Using Back Side Etch

  QUALCOMM INCORPORATED

  0 cites
• US118046452023

  Multi-sided Antenna Module Employing Antennas on Multiple Sides of a Package Substrate for Enhanced Antenna Coverage, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US117912762023

  Package Comprising Passive Component Between Substrates for Improved Power Distribution Network (PDN) Performance

  QUALCOMM INCORPORATED

  0 cites
• US117913202023

  Integrated Circuit (IC) Packages Employing a Package Substrate with a Double Side Embedded Trace Substrate (ETS), and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US117841512023

  Redistribution Layer Connection

  QUALCOMM INCORPORATED

  0 cites
• US117697322023

  Integrated Circuit (IC) with Reconstituted Die Interposer for Improved Connectivity, and Related Methods of Fabrication

  QUALCOMM INCORPORATED

  0 cites
• US117495792023

  Thermal Structures Adapted to Electronic Device Heights in Integrated Circuit (IC) Packages

  QUALCOMM INCORPORATED

  0 cites
• US117496112023

  Package with a Substrate Comprising Periphery Interconnects

  QUALCOMM INCORPORATED

  0 cites
• US117156882023

  Variable Dielectric Constant Materials in Same Layer of a Package

  QUALCOMM INCORPORATED

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• US116826072023

  Package Having a Substrate Comprising Surface Interconnects Aligned with a Surface of the Substrate

  QUALCOMM INCORPORATED

  0 cites
• US116583912023

  Antenna Module

  QUALCOMM INCORPORATED

  0 cites
• US116370572023

  Uniform via Pad Structure Having Covered Traces Between Partially Covered Pads

  QUALCOMM INCORPORATED

  0 cites
• US116055952023

  Packages with Local High-density Routing Region Embedded Within an Insulating Layer

  QUALCOMM INCORPORATED

  0 cites
• US115812512023

  Package Comprising Inter-substrate Gradient Interconnect Structure

  QUALCOMM INCORPORATED

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• US115812622023

  Package Comprising a Die and Die Side Redistribution Layers (RDL)

  QUALCOMM INCORPORATED

  0 cites
• US115629622023

  Package Comprising a Substrate and Interconnect Device Configured for Diagonal Routing

  QUALCOMM INCORPORATED

  0 cites
• USD09756652023

  Susceptor Shaft

  ASM IP Holding B.V.

  0 cites
• US115520152023

  Substrate Comprising a High-density Interconnect Portion Embedded in a Core Layer

  QUALCOMM INCORPORATED

  0 cites
• US115454392023

  Package Comprising an Integrated Device Coupled to a Substrate Through a Cavity

  QUALCOMM INCORPORATED

  0 cites