Patents/Inventors

Angela Kessler

SinzingDE13 patents

12 Patents

US125327372026
Semiconductor Device Package Thermally Coupled to Passive Element
Infineon Technologies AG
0 cites
US124313672025
Embedded Package with Shielding Pad
Infineon Technologies AG
0 cites
US122372462025
Semiconductor Devices Including Parallel Electrically Conductive Layers
Infineon Technologies AG
0 cites
US121502362024
Voltage Regulator Module with Inductor-cooled Power Stage
Infineon Technologies Austria AG
0 cites
US121319882024
Semiconductor Package and Passive Element with Interposer
Infineon Technologies AG
0 cites
US120877402024
Method of Forming a Semiconductor Module
Infineon Technologies Austria AG
0 cites
US120339092024
Die Package and Method of Manufacturing a Die Package
Infineon Technologies AG
0 cites
US120274362024
Package with Clip Having Through Hole Accommodating Component-related Structure
Infineon Technologies AG
0 cites
US120092902024
Semiconductor Module Having a Multi-branch Switch Node Connector
Infineon Technologies Austria AG
0 cites
US118482622023
Semiconductor Package and Passive Element with Interposer
Infineon Technologies AG
0 cites
US118174302023
Semiconductor Module
Infineon Technologies Austria AG
0 cites
US116643042023
Semiconductor Module
Infineon Technologies Austria AG
0 cites