7 Patents
- US125576512026Low-temperature Deposition of High-quality Aluminum Nitride Films for Heat Spreading Applications
Raytheon Company
0 cites - US124976942025Method of Forming Low-resistivity Ru ALD Through a Bi-layer Process and Related Structures
Samsung Electronics Co., Ltd.
0 cites - US121805832024Methods of Forming Low Resistivity Titanium Nitride Thin Film in Horizontal Vias and Related Devices
Merck Patent GmbH
0 cites - US121547872024Methods of Performing Selective Low Resistivity Ru Atomic Layer Deposition and Interconnect Formed Using the Same
The Regents Of The University Of California
0 cites - US120805492024Semiconductor Structure with Nanofog Oxide Adhered to Inert or Weakly Reactive Surfaces
The Regents Of The University Of California
0 cites - US120274882024Methods of Forming Stacked Integrated Circuits Using Selective Thermal Atomic Layer Deposition on Conductive Contacts and Structures Formed Using the Same
Georgia Tech Research Corporation
0 cites - US119938442024Passivation of Silicon Dioxide Defects for Atomic Layer Deposition
The Regents Of The University Of California
0 cites