Andrew J. Brown

13 Patents

• US124944432025

  Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics

  Intel Corporation

  0 cites
• US121104962024

  Method of Determining the Zygosity of Event MON 88302

  Monsanto Technology LLC

  0 cites
• US118814632024

  Coreless Organic Packages with Embedded Die and Magnetic Inductor Structures

  Intel Corporation

  0 cites
• US118625522024

  Methods of Embedding Magnetic Structures in Substrates

  Intel Corporation

  0 cites
• US118240132023

  Package Substrate with Reduced Interconnect Stress

  Intel Corporation

  0 cites
• US118044552023

  Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics

  Intel Corporation

  0 cites
• US117053892023

  Vias for Package Substrates

  Intel Corporation

  0 cites
• US116705042023

  Ultra-thin Dielectric Films Using Photo Up-conversion for Applications in Substrate Manufacturing and Integrating Passives

  Intel Corporation

  0 cites
• US116519022023

  Patterning of Thin Film Capacitors in Organic Substrate Packages

  Intel Corporation

  0 cites
• US116224482023

  Sandwich-molded Cores for High-inductance Architectures

  Intel Corporation

  0 cites
• US116107062023

  Release Layer-assisted Selective Embedding of Magnetic Material in Cored and Coreless Organic Substrates

  Intel Corporation

  0 cites
• US115748742023

  Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch

  Intel Corporation

  0 cites
• US115520102023

  Dielectric for High Density Substrate Interconnects

  Intel Corporation

  0 cites