17 Patents
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- US125123962025Flexible Die to Floor Planning with Bump Pitch Scale Through Glass Core via Pitch
Intel Corporation
0 cites - US123880192025Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites - US123168272025Enhanced Audiovisual Synchronization Using Synthesized Natural Signals
Amazon Technologies, Inc.
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- US120516472024Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites - US120465682024Capacitor Die Embedded in Package Substrate for Providing Capacitance to Surface Mounted Die
Intel Corporation
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- US117282942023Capacitor Die Embedded in Package Substrate for Providing Capacitance to Surface Mounted Die
Intel Corporation
0 cites - US117053982023Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
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- US115629932023Embedded Memory Device and Method for Embedding Memory Device in a Substrate
Intel Corporation
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